MTD 464 Betriebsanleitung PDF herunterladen (Seite 232)

100

101

ARMY TM 9-6115-464-34

AIR FORCE 35C2-3-445-2

NAVY NAVFAC P-8-624-34

(3)

(4)

(5)

(6)

(7)

Figure 3-78. Electro-Hydraulic Governor Control Unit Frequency Sensing Test Circuit

Place the container in a temperature controlled oven. Set the oven temperature at +180 to + 185°F

(+82.2°C to +85°C) and allow the container to soak 11 to 12 hours or until potting compound is

completely melted.

Prior to installing the printed circuit board, remove the container from the oven and make sure that

insulation paper is positioned next to the container shell.

Using heavy gloves and safety glasses, slowly lower the printed circuit board into the potting

compound.

WARNING

Use care not to splash hot potting compound on operating personnel. It can cause

severe injury. Failure to observe this warning could result in servere personal injury or

death.

Position the printed circuit board and allow compound to cool.

When compound has cooled and is substantially solid, install top cover and hardware.

(1) Refer to figure 3-81 for approximate position of controls when connecting linkage. Use figure 3-82

for generators with serial No RZ0001.

3-178

i. Installation

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